1. 2. 3. material content data sheet sales product name bsp171p h6327 issued 29. august 2013 ma# MA001070988 package pg-sot223-4-21 weight* 113.69 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip noble metal gold 7440-57-5 0.077 0.07 679 non noble metal tin 7440-31-5 0.020 0.02 175 inorganic material silicon 7440-21-3 0.875 0.77 0.86 7700 8554 leadframe inorganic material silicon 7440-21-3 0.010 0.01 89 non noble metal titanium 7440-32-6 0.051 0.04 446 non noble metal chromium 7440-47-3 0.152 0.13 1338 non noble metal copper 7440-50-8 50.489 44.41 44.59 444094 445967 wire non noble metal copper 7440-50-8 0.091 0.08 0.08 798 798 encapsulation organic material carbon black 1333-86-4 0.599 0.53 5273 plastics epoxy resin - 8.992 7.91 79094 inorganic material silicondioxide 60676-86-0 50.356 44.29 52.73 442925 527292 leadfinish non noble metal tin 7440-31-5 1.464 1.29 1.29 12877 12877 plating noble metal silver 7440-22-4 0.513 0.45 0.45 4512 4512 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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